| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cooling substrate with improved durability, a package for housing an element, and an electronic device.SOLUTION: A cooling substrate 8 includes: a first substrate 81 having a refrigerant introduction region 81a and a refrigerant discharge region 81b; a passage member 83 which is joined to a region, which is located on the first substrate 81 and between the refrigerant introduction region 81a and the refrigerant discharge region 81b, and allows a refrigerant to pass from the refrigerant introduction region 81a to the refrigerant discharge region 81b; a cooling frame body 82 positioned on the first substrate 81 and disposed enclosing the refrigerant introduction region 81a, the refrigerant discharge region 81b, and the passage member 83; and a second substrate 84 disposed on the cooling frame body 82 covering the passage member 83. The cooling frame body 82 has a fitting part 821 in which the passage member 83 is fitted. Cutouts C are formed at corner parts of the fitting part 821.</p> |
