发明名称 ELECTRODE FORMING DEVICE, ELECTRODE FORMING SYSTEM AND ELECTRODE FORMING METHOD
摘要 An electrode forming device has a pressing unit that presses a substrate on a printing table from above, a suction unit that sucks the substrate on the printing table, a mask member integrally formed with a first mask section used for applying flux on the substrate and a second mask section used for filling a conductive ball on the substrate applied with the flux, a squeegee head that applies the flux via the first mask section, an air cylinder that moves the mask member, and a filling head that fills a conductive ball via the second mask section.
申请公布号 US2015097024(A1) 申请公布日期 2015.04.09
申请号 US201414504582 申请日期 2014.10.02
申请人 Hitachi, Ltd. 发明人 KURIHARA Hirokuni;IGARASHI Akio;MIZUTORI Ryosuke;GOWA Akinori;HASHIMOTO Naoaki
分类号 B23K1/20;B23K3/06;B23K37/04;B23K3/08 主分类号 B23K1/20
代理机构 代理人
主权项 1. An electrode forming device comprising: a pressing unit that presses a substrate on a printing table from above; a suction unit that sucks the substrate pressed by the pressing unit on the printing table and continues to suck the substrate after the pressing unit is released; a mask member that has a first mask section used for applying flux on the substrate and a second mask section used for filling a conductive ball on the substrate applied with the flux, the first mask section and the second mask section being connected to each other or being integrally formed; a squeegee head that applies the flux via the first mask section on the substrate sucked by the suction unit; a mask member moving unit that moves the mask member to adjust a relative position of the mask member to the substrate; and a filling head that fills a conductive ball via the second mask section of the mask member to form an electrode on the substrate sucked by the suction unit.
地址 Tokyo JP