发明名称 |
ELECTRODE FORMING DEVICE, ELECTRODE FORMING SYSTEM AND ELECTRODE FORMING METHOD |
摘要 |
An electrode forming device has a pressing unit that presses a substrate on a printing table from above, a suction unit that sucks the substrate on the printing table, a mask member integrally formed with a first mask section used for applying flux on the substrate and a second mask section used for filling a conductive ball on the substrate applied with the flux, a squeegee head that applies the flux via the first mask section, an air cylinder that moves the mask member, and a filling head that fills a conductive ball via the second mask section. |
申请公布号 |
US2015097024(A1) |
申请公布日期 |
2015.04.09 |
申请号 |
US201414504582 |
申请日期 |
2014.10.02 |
申请人 |
Hitachi, Ltd. |
发明人 |
KURIHARA Hirokuni;IGARASHI Akio;MIZUTORI Ryosuke;GOWA Akinori;HASHIMOTO Naoaki |
分类号 |
B23K1/20;B23K3/06;B23K37/04;B23K3/08 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
1. An electrode forming device comprising:
a pressing unit that presses a substrate on a printing table from above; a suction unit that sucks the substrate pressed by the pressing unit on the printing table and continues to suck the substrate after the pressing unit is released; a mask member that has a first mask section used for applying flux on the substrate and a second mask section used for filling a conductive ball on the substrate applied with the flux, the first mask section and the second mask section being connected to each other or being integrally formed; a squeegee head that applies the flux via the first mask section on the substrate sucked by the suction unit; a mask member moving unit that moves the mask member to adjust a relative position of the mask member to the substrate; and a filling head that fills a conductive ball via the second mask section of the mask member to form an electrode on the substrate sucked by the suction unit. |
地址 |
Tokyo JP |