VACUUM SUCTION DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a vacuum suction device capable of reducing the frequency of adherence of particles to an object even when deformation such as warpage exists in the object which is an object to be sucked such as a wafer.SOLUTION: In the upper part of a ceramic porous body 10, projections 12 are formed which support an object such as a wafer W at the upper end. One or both of an upper end area and arrangement of projections 12 is adjusted so that the difference between D1 and D2 of the projection upper end face density (area density in the upper end of projections 12) is generated in each of a plurality of regions A1 and A2 as defined in the upper part of the ceramic porous body 10.