| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a high-yield, low-cost and high-sensitivity thermal type sensor and heat measurement module, by allowing a separation thin film for thermally separating a temperature sensing part 5 of the thermal type sensor from a substrate 1 to be easily formed in a diaphragm state on a prescribed-shaped hollow 10 without filling the hollow 10 in the substrate 1 with a sacrifice layer and allowing dealing as the flat substrate 1.SOLUTION: A heat-resistant film 2 is attached to a prescribed-shaped hollow 10 formed in a substrate 1, and a thin film temperature sensor 3 is formed in a diaphragm-like temperature sensing part 5 on the hollow 10. The thin film temperature sensor 3 can be used also as a thin film heater 9. Electrode pads of the thin film temperature sensor 3 are formed on the flat and continued heat-resistant film 2 attached to the substrate to prevent a problem of disconnection or the like of wiring of the thermal type sensor by a level difference and to improve a yield. A heat measurement module includes the thermal type sensor, and is mounted with an amplifier circuit and an arithmetic circuit of a signal.</p> |
