SPUTTERING APPARATUS AND SPUTTERING METHOD

摘要

An objective of the present invention is to provide a sputtering apparatus capable of obtaining an adequate film thickness distribution on a substrate surface even if a target projection plane is kept from being projected on the substrate. A sputtering apparatus includes: a process chamber; a substrate holder being rotatable in an in-plane direction of the substrate while holding the substrate; and a sputtering cathode located obliquely to the substrate holder, and arranged to incline to the substrate holder. A projection plane of a target holding surface of the sputtering cathode projected in a direction along a center normal line to the target holding surface onto a plane containing a substrate mounting surface of the substrate holder is formed outside the substrate mounting surface of the substrate holder, and the center normal line to the substrate mounting surface and the center normal line to the sputtering cathode are not coplanar.

主权项

1. A sputtering apparatus comprising:
a process chamber where to process a substrate; a substrate holder arranged inside the process chamber and being rotatable in an in-plane direction of the substrate while holding the substrate; and a target holder located obliquely to the substrate holder, and facing the substrate holder in an inclined manner, wherein a projection plane of a target holding surface of the target holder projected in a direction along a center normal line to the target holding surface onto a plane containing a substrate mounting surface of the substrate holder is formed outside the substrate mounting surface of the substrate holder, and wherein the substrate holder and the target holder are provided at positions where a center normal line to the substrate mounting surface and the center normal line to the target holder are not coplanar when the substrate holder is rotated in the in-plane direction.