| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting device and a manufacturing method of the same, which can improve heat resistance and achieve downsizing.SOLUTION: A semiconductor device comprises: a plurality of light emitting elements 12 each composed of an LED and mounted on a substrate 11; and wavelength conversion members 14 arranged on the light emitting elements 12 in contact with the light emitting elements 12. The wavelength conversion member 14 is formed by coating on one surface of a formation base material 14A, raw material mixture containing a phosphor material and a binder material which contains at least one selected from a group consisting of a silicon oxide precursor which is to become silicon oxide by hydrolysis or oxidation, a silicic acid compound, silica and amorphous silica, and performing reaction at an atmospheric temperature or performing heat treatment at a temperature of 500°C or less. |
