发明名称 CIRCUIT BOARD AND ELECTRONIC APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a circuit board and an electronic apparatus of high reliability, which reduce a shear stress applied to brazing filler metal and prevents detachment of a metal plate from an insulating base.SOLUTION: A circuit board 1 comprises: an insulating base 4; and a metal plate 2 joined to a principal surface of the insulating base 4 via Ag-Cu brazing filler metal 3. The brazing filler metal has an Ag metal phase 8 and a Cu metal phase 11. The Ag metal phase 8 has an end connected to the principal surface of the insulating base 4 and extends in a thickness direction of the brazing filler metal 3. Warp of the Ag metal phase 8 in a direction of the shear stress, which starts from the end connected to the principal surface of the insulating base 4 reduces a shear stress to inhibit breakage of the brazing filler metal 3 by the shear stress and reduces the possibility of detachment of the metal plate 2 from the insulating base 4.</p>
申请公布号 JP2015065313(A) 申请公布日期 2015.04.09
申请号 JP20130198498 申请日期 2013.09.25
申请人 KYOCERA CORP 发明人 SHINNO NORITAKA
分类号 H01L23/13;H01L25/07;H01L25/18 主分类号 H01L23/13
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