| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a management method capable of managing a component mounting substrate used by a roll to roll method, without breaking or degrading an electronic component mounted thereon.SOLUTION: In a case where a flexible component mounting substrate 6 on which a plurality of electronic components 8 are mounted is managed as a winding-up roll 1 on a winding core 2, the component mounting substrate 6 that holds the roll 1 is managed by rotating the roll 1. In this configuration, the plurality of electronic components 8 and a sealing member 10 for sealing them are only to temporarily receive the burden load when traversing above the winding core 2, therefore, the component mounting substrate 6 used by a roll to roll method can be managed without breaking or degrading the electronic components 8 mounted thereon and the sealing member 10.</p> |
