| 摘要 |
When forming field effect transistors according to the gate-first HKMG approach, the cap layer formed on top of the gate electrode had to be removed before the silicidation step, resulting in formation of a metal silicide layer on the surface of the gate electrode and of the source and drain regions of the transistor. The present disclosure improves the manufacturing flow by skipping the gate cap removal process. Metal silicide is only formed on the source and drain regions. The gate electrode is then contacted by forming an aperture through the gate material, leaving the surface of the gate metal layer exposed. |
