METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE

摘要

Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

主权项

1. Method for stripping a product substrate from a carrier substrate, the carrier substrate connected to the product substrate by an interconnect layer, the method including the steps of:
providing
a flexible film having an upper surface and a lower surface, the flexible film including a bonding surface section on the lower surface, an adhesive layer disposed on the bonding surface section for holding the product substrate to the bonding surface section of the flexible film, an attachment section on the lower surface of the flexible film wherein the attachment section surrounds the outer periphery of the bonding surface section and a stripping section located between the bonding surface section and the attachment section, anda film frame mounted to the flexible film at the attachment section; applying a fluid only to an outer periphery of the interconnect layer for at least partial detachment of the interconnect layer; and stripping the product substrate from the carrier substrate from at least a periphery of the product substrate.