| 摘要 |
The present invention relates to an LED module mounting structure of an LED lamp for a ceiling. More particularly, the present invention is to stably attach an LED module without damage to a heat dissipation rib of a thin film. A heat dissipation part is formed by assembling a heat dissipation rib of a thin film fabricated by a press process with an upper and a lower assembly ring. In an LED lamp for a ceiling which form an upper side for mounting an LED by allowing the upper bent part of the heat dissipation rib to face the lower bent part, an insertion hole is formed on one side under the upper bent part of the heat dissipation rib. A reinforcement ring is inserted into the insertion hole. The upper side of the reinforcement ring is inserted into the lower part of the upper bent part of the heat dissipation rib to face each other. A holding plate for installing an LED module is placed on the upper side. The holding plate, the reinforcement ring, the bent part are combined by a fixing bolt. The LED module is placed on the upper side of a ceramic heat dissipation plate located on the center of the holding plate. The ceramic circuit board having the LED module and the holding plate are combined by the fixing bolt. |
