Light Emitting Device Comprising Chip-on-board Package substrate and method for manufacturing

摘要

[Problem] To provide a chip-on-board light emitting device and a method for manufacturing the same such that even though the light emitting device is a chip-on-board light emitting device, it is possible to improve color rendering thereof without excessively reducing the amount of light emission and without installing special circuit patterns or performing current control. [Solution] A chip-on-board light emitting device in which a plurality of LED elements are mounted directly on a package substrate includes a circuit pattern formed on the package substrate, the circuit pattern including a plurality of mounting sections on which the plurality of LED elements are mounted and an anode electrode and cathode electrode pair. The LED elements mounted on the circuit pattern include a plurality of types of LED elements having different emission wavelengths and temperature characteristics, so that by utilizing the temperature characteristics of the plurality of types of LED elements, the device as a whole has a greater average color rendering index (Ra) at an operating temperature than at a ordinary temperature.

主权项

1. A light emitting device having a chip-on-board type package substrate on which a plurality of LED elements are directly mounted, comprising:
a circuit pattern having a plurality of mounting parts, which are formed on the package substrate and on which the plurality of LED elements are mounted, and a pair of an anode electrode and a cathode electrode, wherein each LED element mounted on the circuit pattern includes plural kinds of LED elements which are different from one another in light emission wavelength and in temperature characteristics, and wherein by using the temperature characteristics of the plural kinds of LED elements, an average color rendering index (Ra) as a whole device is configured to become larger at an operating temperature than at an ordinary temperature.