发明名称 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide an alkali-developable photosensitive resin composition which causes less outgassing and is excellent in dry-to-touch property and developability, a dry film comprising the composition, cured products thereof, and a printed wiring board having the cured products.SOLUTION: The alkali-developable photosensitive resin composition contains (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) an epoxy resin, and (D) a (meth)acrylic monomer. The alkali-developable photosensitive resin composition contains an acylphosphine oxide-based photopolymerization initiator as the photopolymerization initiator (B) and contains a bisphenol A novolac type epoxy resin as the epoxy resin (C).
申请公布号 JP2015064546(A) 申请公布日期 2015.04.09
申请号 JP20140001839 申请日期 2014.01.08
申请人 TAIYO INK MFG LTD 发明人 MITANI TAKESHI;KONDO SHINOBU;HARIMA EIJI;FUKUDA SHINICHIRO
分类号 G03F7/029;C08G59/42;G03F7/004;H05K3/28 主分类号 G03F7/029
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