| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer protection film that prevents a scratch from being made on a wafer and that prevents contamination of the wafer.SOLUTION: In a wafer protection film 1, surface layers made of high-density polyethylene manufactured by using a metallocene catalyst are formed on both surfaces of an intermediate layer made of a synthetic resin, respectively. Preferably, an antistatic agent is added to the surface layer to prevent adhesion of dust to the wafer protection film 1 and efficiently release static electricity generated by friction between a wafer 2 and the wafer protection film 1, and a surface resistance value is set to be less than 1×10E+12Ω.</p> |
