发明名称 RESIN COMPOSITION AND HEAT DISSIPATION COMPONENT COMPRISING SAME
摘要 <p>Provided are: a resin composition with which a heat dissipation component having good thermal conductivity can be manufactured; and a heat dissipation component comprising the resin composition. Specifically provided is a resin composition containing 20 mass% to 59 mass% of a thermoplastic resin (A), 1 mass% to 10 mass% of carbon fibers (B), which have a thermal conductivity of at least 150 W/m∙K, and 40 mass% to 70 mass% of graphite particles (C). (However, the total weight of (A), (B) and (C) is set at 100 mass%.) The thermoplastic resin (A) contains: a propylene resin (A1) having a melt float rate of 1.0 g/10 minutes to 200 g/10 minutes, as measured at 230°C with a 21.18 N load; and an ethylene resin (A2) with a melt flow rate of 5.0 g/10 minutes to 300 g/10 minutes, as measured at 190°C with a 21.18 N load, and having a density of 930 kg/m3 to 990 kg/3. Further provided is a heat dissipation component comprising the resin composition.</p>
申请公布号 WO2015050263(A1) 申请公布日期 2015.04.09
申请号 WO2014JP76636 申请日期 2014.09.29
申请人 SUMITOMO CHEMICAL COMPANY, LIMITED 发明人 IKEDA, KENJI;DOBASHI, TETSURO
分类号 C08L23/00;C08K3/04;C08K7/06;H01L23/373;H05K7/20 主分类号 C08L23/00
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