发明名称 CONDUCTIVE PASTE, CONDUCTIVE THIN FILM, AND CIRCUIT
摘要 <p>PROBLEM TO BE SOLVED: To provide a conductive paste that can develop conductivity through a firing process by a superheated steam treatment, can decrease a temperature where conductivity is developed, and can be widely applied to substrates having no heat resistance.SOLUTION: The conductive paste comprises a conductive metal power, a firing binder, a solvent, and an additive, and the conductive paste develops conductivity by a superheated steam treatment after printed or applied.</p>
申请公布号 JP2015065123(A) 申请公布日期 2015.04.09
申请号 JP20130199620 申请日期 2013.09.26
申请人 TOYOBO CO LTD 发明人 OGI KOJI;IMAHASHI SATOSHI;KINAMI KAZUNORI
分类号 H01B1/22;H01B5/14;H01B13/00;H05K3/12 主分类号 H01B1/22
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