| 摘要 |
<p>Provided are a semiconductor device and a method of fabricating the same. The semiconductor device comprises a substrate; a lower electrode formed on the substrate; a dielectric film formed on the lower electrode; an adhesive film formed on the dielectric film; and an upper electrode formed on the adhesive film, wherein the adhesive film is attached to the dielectric film and the upper electrode, and contains a conductive material.</p> |
