| 摘要 |
<p>Provided is a semiconductor device which is strongly connected with a substrate. A penetration concave unit (2x) covered by a thick film plating layer is installed on a front end of an outer lead (11) exposed from an encapsulation resin (5) of a flat lead package. Also, a cutting area of the front end of the outer lead becomes smaller by installing a slope unit (6) covered by the thick film plating layer on a bottom surface.</p> |
