发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To accurately determine a discharge condition of a discharge part.SOLUTION: A substrate processing apparatus comprises a discharge inspection part 5 which includes: a light emission part 51 for emitting planar beams 510 along a predetermined light present surface and irradiating with beams a process liquid which is discharged from a discharge part 34; and an imaging part 52 for imaging the process liquid which passes the planar beams 510 from the light emission part 51 to acquire an inspection image including a bright point distribution region where a plurality of bright points occurring on the process liquid are distributed; and a determination frame setting part for setting, on the inspection image, a first normal discharge determination frame and a second normal discharge determination frame which correspond to an outer contour and an inner contour of the substantially elliptical and annular bright point distribution region, respectively; and a determination part acquiring existence information of the outer contour in the first normal discharge determination frame and existence information of the inner contour in the second normal discharge determination frame to determine the appropriateness of a discharge operation at the discharge part 34 based on the existence information. As a result, the appropriateness of the discharge operation at the discharge part 34 can be determined with high accuracy.
申请公布号 JP2015065371(A) 申请公布日期 2015.04.09
申请号 JP20130199353 申请日期 2013.09.26
申请人 SCREEN HOLDINGS CO LTD 发明人 FURUKAWA ITARU;CHICHIBU TAKAO;SHIGENO YUKIE;KADOMA HISAAKI;SANO HIROSHI
分类号 H01L21/304;B05C5/00;B05C11/10;B08B3/02;G01N21/956;H01L21/027 主分类号 H01L21/304
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