ELECTROSTATIC DISCHARGE (ESD) PROTECTION FOR STACKED ICS

摘要

PROBLEM TO BE SOLVED: To protect stacked ICs from electrostatic discharge (ESD) events.SOLUTION: An unassembled stacked IC device 60 includes an unassembled tier. The device 60 also includes a first unpatterned protective metal layer 610 on the unassembled tier. The first unpatterned protective metal layer 610 protects the unassembled tier from electrostatic discharge (ESD) events.