| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a module component capable of inhibiting bonding reliability from being degraded while restraining a joint material from creeping up to the circuit surface of an element, and a method of manufacturing the module component.SOLUTION: A module component 100 includes: a circuit board 2; at least one element 4 mounted on the circuit board 2 via a joint material 8; and a protrusion 18. The protrusion 18 is at least a part of a position corresponding to the outer periphery of the element 4 in between the circuit board 2 and the element 4, and provided at the position corresponding to a terminal formed in the element 4.</p> |
