LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE INCLUDING THE DEVICE AND LIGHTING APPARATUS INCLUDING THE PACKAGE

摘要

Embodiments provide a light emitting device including a substrate, a light emitting structure disposed under the substrate, the light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, a sub-mount, first and second metal pads disposed on the sub-mount and electrically spaced apart from one another, a one first bump disposed between the first conductive semiconductor layer and the first metal pad and a second bump located between the second conductive semiconductor layer and the second metal pad. A plurality of active areas in which The first semiconductor layer and the active layer are disposed are spaced apart from one another when viewed in plan.

主权项

1. A light emitting device, comprising:
a substrate; a light emitting structure disposed under the substrate, the light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a sub-mount; first and second metal pads disposed on the sub-mount and configured to be electrically spaced apart from one another; at least one first bump disposed between the first conductive semiconductor layer and the first metal pad; and at least one second bump located between the second conductive semiconductor layer and the second metal pad, wherein a plurality of active areas in which the first semiconductor layer and the active layer are disposed are spaced apart from one another when viewed in plan.