ECOLOGICAL METHOD FOR CONSTRUCTING CIRCUIT BOARDS

摘要

A method for fabrication of a circuit board using the disclosed embodiments relies on a CAD model of a multilayer circuit board with conductive elements defined by layer. A first granular conductive material layer is introduced into a mold. A fusion process element traverses across the mold to fuse selected portions of the first granular conductive material layer forming first layer conductive elements. An additional granular conductive material layer is introduced into the mold over the fused selected portions of the first layer and unfused portions of the first layer. The fusion process element is then traversed across the mold to fuse selected portions of the additional granular conductive material layer forming an additional layer of conductive elements. Unfused granular conductive material is then purged from the fused first conductive elements and additional conductive layer elements. A dielectric material is then infused into a structure formed by the fused first conductive elements and additional conductive layer elements.

主权项

1. A method for fabrication of a circuit board comprising:
preparing a CAD model of a multilayer circuit board with conductive elements defined by layer; introducing a first granular conductive material layer into a mold; traversing a fusion process element across the mold to fuse selected portions of the first granular conductive material layer forming first layer conductive elements as defined by the CAD model for the first layer; introducing an additional granular conductive material layer into the mold over the fused selected portions of the first layer and unfused portions of the first layer; traversing the fusion process element across the mold to fuse selected portions of the additional granular conductive material layer forming an additional layer conductive elements as defined by the CAD model for the additional layer; purging unfused granular conductive material from the fused first conductive elements and additional conductive layer elements; infusing a dielectric material into a structure formed by the fused first conductive elements and additional conductive layer elements.