| 摘要 |
Microelectronic assemblies and methods of making the same are disclosed. In some embodiments, a microelectronic assembly (100) includes a microelectronic element (102) having edge surfaces (106) bounding a front surface (104) and contacts (112) at the front surface (104); rigid metal posts (114) disposed between at least one edge surface (106) and a corresponding edge of the assembly (100), each metal post (114) having a sidewall (116) separating first and second end surfaces (118, 120), the sidewalls (116) have a root mean square (rms) surface roughness of less than about 1 micron; a encapsulation (122) contacting at least the edge surfaces (106) and the sidewalls (116); an insulation layer (136) overlying the encapsulation (122); connection elements (128) extending through the insulation layer (136), wherein at least some connection elements (128) have cross sections smaller than those of the metal posts (114); a redistribution structure (126) deposited on the insulation layer (136) and electrically connecting first terminals (131) with corresponding metal posts (114) through the first connection elements (128), some metal posts (114) electrically coupled with contacts (112) of microelectronic element (102). |
