MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD, MANUFACTURING METHOD THEREOF, AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN

摘要

PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component to be embedded in a board and a manufacturing method thereof.SOLUTION: There is provided a multilayer ceramic electronic component to be embedded in a board, in which the thickness of a ceramic body in an entire chip is increased by reducing the thickness of an external electrode while forming a band surface of the external electrode of a predetermined length or longer for connecting to an external wiring through a via hole, so that the chip strength may be improved and the occurrence of damage such as breakage may be prevented. Also provided is a manufacturing method thereof.