发明名称 |
OXIDE FILM FORMATION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a formation method of a single crystal oxide film, which achieves high productivity; or provide a formation method of a single crystal oxide film at lower temperature; or provide a formation method of a single crystal oxide film by a simpler method.SOLUTION: A formation method of an oxide film comprises the steps of: forming on a formed surface, the oxide film having crystal parts; and performing a heat treatment on the oxide film to change crystallinity of the oxide film to a single crystal. In addition, as the oxide film formed on the formed surface, an oxide film in which c-axes in the crystal parts are aligned to a direction parallel with a normal direction of the formed surface or a normal direction of a surface of the oxide film, and which has no crystal grain boundary between the crystal parts in the oxide film is used.</p> |
申请公布号 |
JP2015065424(A) |
申请公布日期 |
2015.04.09 |
申请号 |
JP20140167526 |
申请日期 |
2014.08.20 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
SHIMOMURA AKIHISA;OTA MASASHI;YAMADA YOSHINORI |
分类号 |
H01L29/786;C30B1/04;C30B29/22;H01L21/20;H01L21/336;H01L21/363;H01L21/8242;H01L27/108;H01L51/50 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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