发明名称 |
Packaged Semiconductor Device Having Multilevel Leadframes Configured as Modules |
摘要 |
Fabricating a packaged semiconductor device provides first planar leadframe with first leads and pads having attached electronic components. The first leadframe has a set of elongated leads bent at an angle away from the plane of the first leadframe. A second planar leadframe has second leads having attached electronic components. The bent leads of the first leadframe conductively connected to the second leadframe, forming a conductively linked 3-dimensional network between components and leads in two planes. |
申请公布号 |
US2015099329(A1) |
申请公布日期 |
2015.04.09 |
申请号 |
US201414572988 |
申请日期 |
2014.12.17 |
申请人 |
Texas Instruments Incorporated |
发明人 |
Saye Richard J. |
分类号 |
H01L25/00;H01L21/52;H01L23/495;H01L21/56 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Dallas TX US |