发明名称 |
LIGHT EMITTING DEVICE MOUNTING STRUCTURAL BODY |
摘要 |
A light emitting device mounting structural body includes a wiring substrate having wirings disposed on a base member and a light emitting device having a resin molded body mounted on the wiring substrate. The wiring substrate has a recess in its periphery. The resin molded body has a lower surface and a side surface. The lower surface has an arrangement portion and a projecting portion, the arrangement portion has an outer lead electrically connected to the wiring portion disposed beneath the arrangement portion, and the projecting portion is projected further downward relative to the arrangement portion. The side surface has an opening with a light emitting element mounted thereon, the opening is expanded in the projecting portion, and at least a portion of the opening is housed in the recess of the wiring substrate. |
申请公布号 |
US2015098248(A1) |
申请公布日期 |
2015.04.09 |
申请号 |
US201414505519 |
申请日期 |
2014.10.03 |
申请人 |
NICHIA CORPORATION |
发明人 |
WAKAKI Ryosuke |
分类号 |
F21V23/00;F21V7/00;F21V8/00;F21V21/00 |
主分类号 |
F21V23/00 |
代理机构 |
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代理人 |
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主权项 |
1. A light emitting device mounting structural body comprising:
a wiring substrate having wirings disposed on a base member; and a light emitting device having a resin molded body mounted on the wiring substrate; wherein the wiring substrate has a recess in its periphery; the resin molded body has a lower surface and a side surface; the lower surface has an arrangement portion and a projecting portion, the arrangement portion having an outer lead electrically connected to the wiring portion disposed beneath the arrangement portion, and the projecting portion being projected further downward relative to the arrangement portion; the side surface having an opening with a light emitting element mounted thereon, the opening being expanded in the projecting portion; and at least a portion of the opening is housed in the recess of the wiring substrate. |
地址 |
Anan-shi JP |