| 发明名称 |
In Situ Real-Time Wafer Breakage Detection |
| 摘要 |
The disclosure provides a real-time wafer breakage detection method. The detection method includes the following operations. A wafer is positioned on a wafer holder of a process chamber in which a thermal process is being performed. Then, the temperature at the wafer holder is measured. And, a notification for corrective action is issued if the temperature is out of a predetermined alarm range. |
| 申请公布号 |
US2015097676(A1) |
申请公布日期 |
2015.04.09 |
| 申请号 |
US201314049464 |
申请日期 |
2013.10.09 |
| 申请人 |
Taiwan Semiconductor Manufacturing Co., LTD. |
发明人 |
Liu Su-Hao;Lin Chien-Hung;Huang Wei-Han;Fang Zi-Wei |
| 分类号 |
H01L21/66;G08B21/18 |
主分类号 |
H01L21/66 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A real-time wafer breakage detection method, comprising:
positioning a wafer on a wafer holder of a process chamber in which a thermal process is being performed; measuring at least one temperature at at least one point of the wafer holder; and issuing a notification for corrective action if at least one of the at least one temperature is out of a predetermined alarm range. |
| 地址 |
Hsinchu TW |
