| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which can be cured at a low temperature and gives a cured film achieving all of high sensitivity, high elongation, and good storage stability, a method for producing a cured relief pattern which forms a pattern using the photosensitive resin composition, and a semiconductor device and a display device having the cured relief pattern.SOLUTION: The photosensitive resin composition contains a phenol resin (A), a photoacid generator (B), a crosslinking agent (C), a C3-C30 solvent (D) represented by general formula (1) {where Ris a C2-C29 divalent or trivalent organic group, Ris a hydrogen atom or a monovalent or divalent organic group, and Rand Rmay be linked together to form a ring structure}, and a solvent (E) different from the solvent (D). The mass content of the solvent (D) is less than that of the solvent (E). |
