MANUFACTURING METHOD OF INTERPOSED SUBSTRATE

摘要

A manufacturing method of an interposed substrate is provided. A photoresist layer is formed on a metal carrier. The photoresist layer has plural of openings exposing a portion of the metal carrier. Plural of metal passivation pads and plural of conductive pillars are formed in the openings. The metal passivation pads cover a portion of the metal carrier exposed by openings. The conductive pillars are respectively stacked on the metal passivation pads. The photoresist layer is removed to expose another portion of the metal carrier. An insulating material layer is formed on the metal cattier. The insulating material layer covers the another portion of the metal carrier and encapsulates the conductive pillars and the metal passivation pads.;An upper surface of the insulating material layer and a top surface of each conductive pillar are coplanar. The metal carrier is removed to expose a lower surface of the insulating material layer.

主权项

1. A manufacturing method of an interposed substrate comprising:
providing a metal carrier; forming a photoresist layer on the metal carrier, wherein the photoresist layer has a plurality of openings, and a portion of the metal carrier is exposed by the openings; forming a plurality of metal passivation pads in the openings of the photoresist layer, wherein the metal passivation pads cover the portion of the metal carrier exposed by the openings; forming a plurality of conductive pillars in the openings of the photoresist layer, wherein the conductive pillars are respectively stacked on the metal passivation pads; removing the photoresist layer to expose another portion of the metal carrier; forming an insulating material layer on the metal carrier, wherein the insulating material layer covers the anther portion of the metal carrier and encapsulates the conductive pillars and the metal passivation pads; and removing the metal carrier to expose a lower surface opposite to an upper surface of the insulating material layer.