发明名称 |
METHOD FOR RELAXING THE TRANSVERSE MECHANICAL STRESSES WITHIN THE ACTIVE REGION OF A MOS TRANSISTOR, AND CORRESPONDING INTEGRATED CIRCUIT |
摘要 |
The transverse mechanical stress within the active region of a MOS transistor is relaxed by forming an insulating incursion, such as an insulated trench, within the active region of the MOS transistor. The insulated incursion is provided at least in a channel region of the MOS transistor so as to separate the channel region into two parts. The insulated incursion is configured to extend in a direction of a length of the MOS transistor. The insulated incursion may further extend into one or more of a source region or drain region located adjacent the channel region of the MOS transistor. |
申请公布号 |
US2015097241(A1) |
申请公布日期 |
2015.04.09 |
申请号 |
US201414505570 |
申请日期 |
2014.10.03 |
申请人 |
STMicroelectronics (Crolles 2) SAS ;STMicroelectronics SA ;Commissariat A L'Energie Atomique et aux Energies Alternatives |
发明人 |
Rideau Denis;Baylac Elise;Richard Emmanuel;Andrieu Francois |
分类号 |
H01L27/12;H01L29/66;H01L29/10;H01L29/786 |
主分类号 |
H01L27/12 |
代理机构 |
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代理人 |
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主权项 |
1. A method for relaxing transverse mechanical stresses within an active region of a MOS transistor, comprising:
forming at least one insulating incursion into at least a channel region of the MOS transistor, wherein said insulating incursion extends in a direction of a length of the channel region and separates at least the channel region into two parts in a direction of a width of the channel region; wherein the MOS transistor is formed on a substrate of a silicon-on-insulator type comprising a silicon film separated from a carrier substrate by a buried insulating layer, and wherein each insulating incursion is formed in the silicon film. |
地址 |
Crolles FR |