发明名称 METHOD FOR RELAXING THE TRANSVERSE MECHANICAL STRESSES WITHIN THE ACTIVE REGION OF A MOS TRANSISTOR, AND CORRESPONDING INTEGRATED CIRCUIT
摘要 The transverse mechanical stress within the active region of a MOS transistor is relaxed by forming an insulating incursion, such as an insulated trench, within the active region of the MOS transistor. The insulated incursion is provided at least in a channel region of the MOS transistor so as to separate the channel region into two parts. The insulated incursion is configured to extend in a direction of a length of the MOS transistor. The insulated incursion may further extend into one or more of a source region or drain region located adjacent the channel region of the MOS transistor.
申请公布号 US2015097241(A1) 申请公布日期 2015.04.09
申请号 US201414505570 申请日期 2014.10.03
申请人 STMicroelectronics (Crolles 2) SAS ;STMicroelectronics SA ;Commissariat A L'Energie Atomique et aux Energies Alternatives 发明人 Rideau Denis;Baylac Elise;Richard Emmanuel;Andrieu Francois
分类号 H01L27/12;H01L29/66;H01L29/10;H01L29/786 主分类号 H01L27/12
代理机构 代理人
主权项 1. A method for relaxing transverse mechanical stresses within an active region of a MOS transistor, comprising: forming at least one insulating incursion into at least a channel region of the MOS transistor, wherein said insulating incursion extends in a direction of a length of the channel region and separates at least the channel region into two parts in a direction of a width of the channel region; wherein the MOS transistor is formed on a substrate of a silicon-on-insulator type comprising a silicon film separated from a carrier substrate by a buried insulating layer, and wherein each insulating incursion is formed in the silicon film.
地址 Crolles FR