发明名称 METHOD AND APPARATUS FOR ELECTROLYTICALLY DEPOSITING A DEPOSITION METAL ON A WORKPIECE
摘要 For improving the current transfer during the electrolytic metallization of workpieces, a method is proposed: (a) providing a metal depositing apparatus 17, in which the workpiece, at least one anode 40, 41 and a metal deposition electrolyte AE are arranged and which has a device for electric current generation 60 and at least one current feeding device 31 with in each case at least one electrical contact element 34, 35 for making electrical contact with the workpiece; (b) bringing the at least one electrical contact element 34, 35 into contact with the workpiece; and (c) feeding electric current to the workpiece via the at least one electrical contact element 34, 35 in order that the deposition metal deposits on the workpiece. Before method step (b), in a further method step (d), deposition metal is deposited on the at least one electrical contact element 34, 35.
申请公布号 US2015096895(A1) 申请公布日期 2015.04.09
申请号 US201314396348 申请日期 2013.04.16
申请人 Atotech Deutschland GmbH 发明人 Britz Dominik;Schmitt Bernd;Böse Bernd;Mücklich Frank;Selzner Christian
分类号 C25D17/28;C25D17/00 主分类号 C25D17/28
代理机构 代理人
主权项 1. Method for electrolytically depositing a deposition metal on a workpiece (WS), comprising the following method steps: (a) providing an electrolytic metal depositing apparatus (17), in which the workpiece (WS), at least one anode (40, 41) and a deposition electrolyte (AE) are arranged and which has a device for electric current generation (60) and at least one current feeding device (31, 70) with in each case at least one electrical contact element (34, 35) for making electrical contact with the workpiece (WS); (b) bringing the at least one electrical contact element (34, 35) into contact with the workpiece (WS); and (c) feeding electric current to the workpiece (WS) via the at least one electrical contact element (34, 35) in order that the deposition metal deposits on the workpiece (WS);characterized in that, before method step (b), in a further method step (d), the deposition metal is deposited on the at least one electrical contact element (34, 35).
地址 Berlin DE