| 摘要 |
<p>A synthetic resin electro-less intenna plating method and a rear case thereof are provided to simplify the process, to improve adhesion of a plating layer, to induce an eco-friendly enviornment, and to achieve economic feasibility, reliability of product, and eco-friendly property. The method comprises: a laser processing step of irradiating a laser to an area to be plated on the surface of synthetic resin materials, to form bumps, and to create circuit patterns; an ultrasonic wave cleaning and penetration step of infiltrating a cleaning solution into the floor with the bumps and performing cleaning using ultrasonic waves; an activation step of infiltrating a catalyst into the floor with the bumps with a guiding means so that the catalyst can be adsorbed to the guiding means; a plating step of plating circuit patterns with the bumps with copper and nickel; and a post-processing step of post-processing the nickel-coated surface.</p> |
