RESIN SHEET, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide: a resin sheet which is superior in shelf stability when being stored in a vacuum packaging container; and a method for manufacturing an electronic device package.SOLUTION: A resin sheet is used in a method for manufacturing an electronic device package which comprises the steps of: arranging the resin sheet over an electronic device mounted on a board; putting the electronic device mounted on the board, and the resin sheet arranged over the electronic device in a vacuum packaging container; and sealing in the electronic device in the vacuum packaging container by use of the resin sheet. In the resin sheet, the rate of change in complex viscosity at 100°C is 35% or less, which is calculated from a particular formula.