| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a metal-clad laminate which can improve connection reliability between a semiconductor element and a printed wiring board, and to provide a printed wiring board and a semiconductor device in each of which the metal-clad laminate is used.SOLUTION: A metal-clad laminate 100 has: an insulation layer 101 containing an epoxy resin composition E and a fibrous base material; and metal foil sheets 103 on both surfaces respectively, of the insulation layer. The epoxy resin composition contains an epoxy resin A, a bismaleimide compound B and an inorganic filler C. When the metal foil sheets on both sides are removed by etching from the metal-clad laminate 100 and first thermomechanical analysis measurement and second thermomechanical analysis measurement are performed successively on the metal foil sheet-removed metal-clad laminate, (L-L)/Lis 0.03-0.10 in which the length of the insulation layer 101 in the vertical direction is defined as a reference length Lbefore the first thermomechanical analysis measurement is performed, the deformation amount of the reference length of the insulation layer 101 in the vertical direction is defined as Lat 30°C at a second heating step and the deformation amount of the reference length of the insulation layer 101 in the vertical direction is defined as Lat 30°C at a second cooling step.</p> |
