发明名称 METHOD FOR DOPANT IMPLANTATION OF FINFET STRUCTURES
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for implanting dopant elements in a structure comprising a plurality of semiconductor fins separated by field dielectric areas.SOLUTION: The method includes the steps of: depositing a BARC layer 4 on fins; depositing a resist layer 5 on the BARC layer; removing a portion of the resist layer by lithography steps to thereby expose an area 10 of the BARC layer; removing the BARC layer in the area 10 by a dry etch process using the remaining resist layer as a mask; implanting dopant elements into the fins present in the area 10 using the BARC and resist layers as a mask; and removing the remainder of the resist and BARC layers. The method additionally includes depositing an etch stop layer 3 directly on the fins 1 before the steps of depositing the BARC layer 4 and the resist layer 5.</p>
申请公布号 JP2015065412(A) 申请公布日期 2015.04.09
申请号 JP20140145950 申请日期 2014.07.16
申请人 IMEC VZW 发明人 VASILE PARASCHIV;WINROTH GUSTAF;EFRAIN ALTAMIRANO SANCHEZ;SABRINA LOCOROTONDO;RAJA ATHIMULAM
分类号 H01L21/266;H01L21/265;H01L21/316;H01L21/336;H01L29/78 主分类号 H01L21/266
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