| 摘要 |
PROBLEM TO BE SOLVED: To provide means of practically inhibit non-elastic strain of a lead-free solder layer in a semiconductor device such as a power module using a lead-free solder to improve reliability of the semiconductor device.SOLUTION: A semiconductor device comprises a substrate 11, a semiconductor element 12 arranged on the substrate, and an Sn solder layer 13 arranged so as to bond the semiconductor element with the substrate. The Sn solder layer 13 is arranged in a manner such that a C-axis of an Sn crystal in the Sn solder layer is substantially orthogonal to the maximum principal stress direction of the Sn solder layer. |
