| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an adhesive substrate manufacturing method which does not leave an adhesion failure part even when a surface of an adhesive swells to form a salient and which does not require a process of attaching the adhesive to a substrate by spin coating and the like to be performed a plurality of times.SOLUTION: A manufacturing method of an adhesive substrate 10 comprises: an adhering material attachment process (S12) of attaching an adhesive 22 to a whole area of a bonding plane of a wafer 21; an opening formation process (S13) of removing a part of the adhesive 22 to form openings 22B, 22C; and a substrate bonding process (S14) of bonding a wafer 23 to the wafer 21 via the adhesive 22. In the adhesive attachment process (S12), an edge bead 22A is formed on a surface of the adhesive 22. In the opening formation process (S13), the opening 22C which partially overlaps the edge bead 22A is provided. In the substrate bonding process (S14), the wafer 23 is bonded on the edge bead 22A in an overlapping manner.</p> |
