| 发明名称 |
RELEASE LAYER, SUBSTRATE STRUCTURE, AND METHOD FOR MANUFACTURING FLEXIBLE ELECTRONIC DEVICE |
| 摘要 |
Disclosed is a substrate structure for manufacturing a flexible electronic device, including a supporting layer, a release layer covering the supporting layer with a first area, wherein the release layer is an aromatic polyimide, and a flexible layer covering the supporting layer and the release layer with a second area. The second area is greater than the first area. The adhesion force between the flexible layer and the supporting layer is stronger than the adhesion force between the release layer and the supporting layer. |
| 申请公布号 |
US2015099088(A1) |
申请公布日期 |
2015.04.09 |
| 申请号 |
US201414264742 |
申请日期 |
2014.04.29 |
| 申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
LIN Chih-Cheng;LEU Chyi-Ming;KUO Yu-Ju |
| 分类号 |
C08G73/10;B32B43/00;B32B37/16;B32B38/00;C09D179/08;B32B37/02 |
主分类号 |
C08G73/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A release layer, being an aromatic polyimide, and the release layer is applied to flexible electronic device processes. |
| 地址 |
Hsinchu TW |
