| 发明名称 |
PLUG VIA FORMATION WITH GRID FEATURES IN THE PASSIVATION LAYER |
| 摘要 |
Solder bump connections and methods for fabricating solder bump connections. A passivation layer is formed on a dielectric layer. Via openings extend through the passivation layer from a top surface of the passivation layer to a metal line in the passivation layer. A conductive layer is formed on the top surface of the passivation layer and within each via opening. When the passivation layer and the conductive layer are planarized, a plug is formed that includes sections in the via openings. Each section is coupled with the metal line. |
| 申请公布号 |
US2015097283(A1) |
申请公布日期 |
2015.04.09 |
| 申请号 |
US201314048483 |
申请日期 |
2013.10.08 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Daubenspeck Timothy H.;Gambino Jeffrey P.;Misra Ekta;Muzzy Christopher D.;Sauter Wolfgang |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of fabricating a solder bump connection, the method comprising:
forming a passivation layer on a dielectric layer; forming a plurality of via openings extending through the passivation layer from a top surface of the passivation layer to a metal line in the passivation layer; forming a conductive layer on the top surface of the passivation layer and within each via opening; and planarizing the passivation layer and the conductive layer to define a first plug comprised of a plurality of sections in the via openings that are each coupled with the metal line. |
| 地址 |
Armonk NY US |
