| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a vacuum vapor deposition apparatus capable of removing adhering films from oscillators while maintaining vacuum atmosphere in a vacuum tank, and to provide a method for manufacturing a thin film. <P>SOLUTION: A thin film forming method forms a thin film on a substrate 16 while discharging vapor from a vapor deposition material into an evacuated vacuum tank 11, sticking vapor to the surfaces of oscillators 31a, 31b contacted and held on holders 32a, 32b and measuring the film thickness of adhering films. In the thin film forming method, while maintaining vacuum atmosphere in the evacuated vacuum tank 11 by using the oscillators 31a, 31b and the holders 32a, 32b of which the melting points are respectively higher than an evaporation temperature of the adhering films and holder heating devices 33a, 33b, the holders 32a, 32b are heated to a temperature lower than both of the melting point of the holders 32a, 32b and the melting point of the oscillators 31a, 31b and higher than the evaporation temperature of the adhering films, the oscillators 31a, 31b are heated by thermal conduction from the holders 32a, 32b, and the adhering films are evaporated and removed from the oscillators 31a, 31b. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
