发明名称 半導体基板の製造方法
摘要 <p>A semiconductor substrate includes: single crystal silicon; a mask material formed on a surface of the single crystal silicon and having an opening; a silicon carbide film formed on a portion exposed in the opening of the single crystal silicon; and a single crystal silicon carbide film formed so as to cover the silicon carbide film and the mask material. The mask material has a viscosity of 105 Pa·S or more and 1014.5 Pa·S or less in a temperature range of 950 to 1400° C.</p>
申请公布号 JP5696543(B2) 申请公布日期 2015.04.08
申请号 JP20110059273 申请日期 2011.03.17
申请人 发明人
分类号 H01L21/205;C30B29/36 主分类号 H01L21/205
代理机构 代理人
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