发明名称 基板および基板の製造方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a board usable with a large current, such as a DC-DC converter, and a method of manufacturing a board, which enable small electronic components to be arranged on the single board. <P>SOLUTION: A board 1 is a board having a transformer 3 and a choke coil 5 which can be used, for example, as an automotive DC-DC converter. The board 1 is so constructed that electronic components are mounted on an injection-molded substrate 2 in which internal circuit conductors are exposed out at electronic component mounting portions 7, a printed board mounting portion 11 and conductive portions 10a, and the other regions are coated in a resin 9. The printed board mounting portion 11 is a region where a printed board 15 is mounted. A conductive portion 10b of the printed board 15 is soldered or otherwise bonded to the conductive portion 10a of the printed board mounting portion 11 via an electronic component 17. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5697020(B2) 申请公布日期 2015.04.08
申请号 JP20100260494 申请日期 2010.11.22
申请人 发明人
分类号 H05K1/14;H05K1/02;H05K1/18;H05K3/00;H05K3/36 主分类号 H05K1/14
代理机构 代理人
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