| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide technique for preventing adhesion of particles to a substrate when the substrate is transported to a substrate holding tool and preventing a temperature rise of an upper side of a loading chamber when the substrate holding tool is unloaded in the loading chamber after heat treatment. <P>SOLUTION: A heat treatment apparatus includes: a gas circulation mechanism for forming an air flow in a lateral direction by clean gas from an air inlet to an air outlet in the loading chamber; and an air flow adjustment mechanism which is installed in the air inlet and adjusts a flow ratio of a ventilation flow on the upper side for a ventilation flow on a lower side of the loading chamber on the air flow. The air flow adjustment mechanism operates in such a way as to make the flow ratio in a state where the substrate holding tool holding the heat-treated substrate stands by at an unload position and delivery of the heat-treated substrate is not started yet becomes larger than that when the substrate is delivered to the substrate holding tool, and cooling of the upper side of the loading chamber is promoted. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
