发明名称 ミラーリングされた相互接続構造を有するプログラマブル集積回路
摘要 <p>A programmable integrated circuit (IC) with mirrored interconnect structure. The IC includes a plurality of arrangements, which are horizontally arranged. Each arrangement includes a first logic column, an interconnect column, and a second logic column. Each interconnect column includes programmable interconnect blocks (148), and each of the first and second logic columns includes programmable logic blocks. Each programmable interconnect block provides a plurality of first input and output ports on a first side and a plurality of second input and output ports on a second side. The first ports and the first side of each of the programmable interconnect blocks physically mirror the second ports and the second side of the programmable interconnect block. The ports of the programmable interconnect blocks are coupled to the ports of the programmable logic blocks in the first and second logic columns.</p>
申请公布号 JP5698268(B2) 申请公布日期 2015.04.08
申请号 JP20120552857 申请日期 2010.10.20
申请人 发明人
分类号 H03K19/177 主分类号 H03K19/177
代理机构 代理人
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