发明名称 |
SEMICONDUCTOR MODULE AND PRODUCTION METHOD FOR SAME |
摘要 |
There is provided a semiconductor module and a method for manufacturing the same which make it possible to joint the electrode of the bare-chip transistor and the wiring pattern on the substrate by solder mounting operation, in the same process of solder mounting operation for mounting the bare-chip transistor or other surface mounting devices on the wiring patterns on the substrate A semiconductor module (30) includes: a plurality of wiring patterns (33a) to (33d) formed on an insulating layer (32); a bare-chip transistor (35) mounted on one wiring pattern (33a) out of the plurality of wiring patterns (33a) to (33d) via a solder (34a); and a copper connector (36a), (36b) constituted of a copper plate for jointing an electrode (S), (G) formed on a top surface of the bare-chip transistor (35) and another wiring pattern (33b), (33c) out of the plurality of wiring patterns (33a) to (33d) via a solder (34a), (34c). |
申请公布号 |
EP2858100(A1) |
申请公布日期 |
2015.04.08 |
申请号 |
EP20130797985 |
申请日期 |
2013.05.27 |
申请人 |
NSK LTD. |
发明人 |
SUNAGA, TAKASHI;KANEKO, NOBORU;MIYOSHI, OSAMU |
分类号 |
H01L21/60;H01L23/48;H01L25/07;H01L25/18 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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