发明名称 Heat pump type speed heating apparatus
摘要 A heat pump type speed heating apparatus according to the present invention comprises a cooling cycle circuit; a hot water supply heat exchanger connected to the cooling cycle circuit through a hot water supply flow path for a refrigerant discharged from the compressor of the cooling cycle circuit to be condensed, expanded, and evaporated after being used for hot water supply; a refrigerant controller which controls the refrigerant discharged from the compressor to pass through or bypass the hot water supply heat exchanger; and a heat exchanger bypass flow path connected to guide the refrigerant which has passed the hot water heat exchanger between the outdoor heat exchanger and the indoor heat exchanger; thus the heat pump type speed heating apparatus can raise the temperature of the hot water supply tub quickly at the time of hot water supply operation; at the time of simultaneous operation of hot water supply and air conditioning, the heat of the refrigerant can be used for indoor air conditioning after being used to raise the temperature of the hot water supply tank.
申请公布号 EP2381178(A3) 申请公布日期 2015.04.08
申请号 EP20110161827 申请日期 2011.04.11
申请人 LG ELECTRONICS INC. 发明人 NOH, JINHEE;PARK, NOMA;PARK, HEEWOONG;CHOI, HWANGJONG
分类号 F24D3/08;F24D3/18;F24D17/02 主分类号 F24D3/08
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