PIPERAZINE DERIVATIVES AND THERMALLY CURABLE RESIN COMPOSITION COMPRISING THE SAME

摘要

The present invention relates to a novel piperazine derivative and a thermosetting resin composition comprising the same. Provided is an effect of improving the strength of an overcoat film when the thermosetting resin composition is applied to the overcoat film of an electronic device. The thermosetting resin composition according to the present invention comprises: at least one compound represented by chemical formula 1; a binder resin containing an epoxy group; and a solvent.