| 摘要 |
<p>Disclosed in the present invention is a light emitting device with excellent electrical properties and heat radiation, and improved reliability. The disclosed light emitting diode comprises a first and second metal frame separated from each other in a certain distance; a third metal frame located between the first and second metal frames; a light emitting diode chip mounted on the third frame; and an insulation part located between the second and third metal frames, and having an insulation and adhesive function, wherein the third metal frame includes a metal material having the thermal conductivity higher than the first and second metal frames. Therefore, provided in the present invention is a metal substrate having a simplified structure in which the first and second metal frames, and the third metal frame located between the first and the second metal frames are assembled by the first and second insulation part, and an advantage of excellent electrical properties and heat radiation is obtained by the light emitting diode chip mounted on the third metal frame having excellent heat conductivity compared with the first and second metal frames.</p> |
